13 July 2017
This application note presents the new ISOPLUS247 power package featuring 2500 V internal isolation, which gives a revolutionary approach that improves thermal conductance and reliability. The document also describes the advantages of the isolated and hole-less packaging concept and a brief table and graphical comparisons of some characteristics of the IXFR55N50 to IXFX55N50. The new ISOPLUS247 has an internally isolated mounting tab with a 2500 V (RMS) isolation voltage rating. The package meets the standard JEDEC TO-247 outline and is intended for pressure mounting applications since there is no mounting screw hole. As can be seen in Figure 1, the usual copper lead frame has been replaced by a direct-copper-bonded (DCB) alumina substrate possessing both high thermal conductance and high electrical isolation (2500 V).
There are multiple advantages to this isolated and hole-less packaging concept.
The primary advantage of ISOPLUS247 packaging is the very low thermal resistance achievable in a rugged, high voltage, isolated mounting system. Figure 2 shows the allowable current handling capabilities of the various mounting conditions.
Conversely, the chip can run up to 29°C cooler for the same operating conditions that translate into more reliable operation. Because there is such a potentially large decrease in junction-to-case thermal resistance, it may be possible to use a smaller chip for the same current, which would more than cover for the extra price.
Source : IXYSBack
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